Ceramic Leadless Chip Carrier

It is manufactured in the form of circuit board in ceramic that it has the structure of high reliability and easy for heat radiation. In the ceramic, there are the lead for connection to the chip and wire bonding and the BGA or Land for connection to module board and SMT on its bottom. For the protection from foreign matters in the image sensor, there is the cover glass on the ceramic body on the top of chip to protect the sensor from outside damages.