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Current patent status
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- Patent :No. 10-1564319
- Application number :No. 10-2014-0013053
- Date of application :2014년 02월 05일
- Registration date :2015년 10월 23일
- Name of invention :Image sensor module and its manufacturing method
- Holder of patent :Describe it in the registration line
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Effect of invention
According to this invention, by manufacturing the protective cover which protects the image sensor from the foreign matters using the liquid or transparent powder, it keeps the optical feature like the transparent glass but simplifies the manufacturing process of the protective cover. In addition, according to this invention, by simplifying the manufacturing process of protective cover which protects the image sensor from the foreign matters, the production of image sensor is enhanced and the manufacturing cost of the image sensor module is lowered.
As the clear epoxy is coated on the image sensors displayed over the circuit board, the cover glass is not required. As the wire is molded, the good quality can be acquired which is free from foreign matters and the cost can be lowered.
