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기술분야
TECH 기술분야
Die Attach
> 기술분야 > Assembly > Die Attach
장비 능력
| Min/ Max Die Size | 0.87~25mm |
|---|---|
| Thin die Capability | 75㎛ |
| Accuracy for XY and Theta | XY : ±25㎛ Theta : 0.5 |
| Camera Magnification Pre Bond/Bond Post Bon |
Pre Bond : 0.23~0.46 Option Bond Post bond : 0.15~0.87 Zoom |
| Wafer Size | 8inch ~ 12inch |
| Bond Force (Standard) | 15N |