기술분야
Glass thickness | 20um |
---|---|
Glass handling size | 1.02 x 1.02mm(min), 50 x 50mm(Max) |
Glass placement | +/- 15um @ 3σ (Auto Inspection & align system) |
Glass theta rotation | +/- 0.15° @ 3σ (Auto Inspection & align system) |
Glass wafer size | 8” and 12” |
Package handled | LCC, Leadframe, BGA, CSBGA, Stacked CSP,, |
Disepense handled | Pattern, Glop top(COB), Potting, Under-fill, Molding,, |